| 摘要 |
PROBLEM TO BE SOLVED: To make it possible to correctly connect each electrode to an external electric circuit for a long period of time by a method wherein a connection pad of a metallized wiring layer is formed on the bottom face of a number of recessed parts of an insulated board, the terminal, having a globular protruding part, is soldered to the connection pad, and the bottom face area of the recessed part on the lower surface of the insulated board is made larger than the area of the aperture part of the recessed part. SOLUTION: A number of recessed parts 1b are provided on the lower surface of an insulated board 1, the connection pad 5a of a metallized wiring layer 5 is formed on the bottom face of the recessed parts 1b so that the connection pad 5a can be electrically connected. A terminal 7, having a globular protruding part 7a, is soldered to the connection pad 5a. At this time, the area of the bottom face of the recessed parts 1b, provided on the lower surface of the insulated board 1, is formed larger than the area of the aperture part of the recessed parts 1b. As a result, each electrode of a semiconductor integrated circuit element can be electrically connected correctly to the prescribed external electric circuit for a long period of time. |
