发明名称 AUTOMATIC FOCUSSING MECHANISM FOR WAFER
摘要 PURPOSE:To adjust the focus to the surface of a wafer simply and automatically by projecting transmitted beams from mutually orthogonal slits at a distance very smaller than the focal distance of a microscope to the surface of the wafer and detecting reflected beams from the surface. CONSTITUTION:A wafer to be observed 10 is placed on a sample base 11. Beams from a light source lamp 2 transmit a slit a3 and a slit b4, and are projected onto the wafer 10 through a half mirror 5 and an objective 1. Reflected beams of beams projected to the wafer 10 are received by a CCD-A8 receiving transmitted beams from the slit a3 and a CCD-B9 receiving transmitted beams from the slit b4 through the objective 1, the half mirror 5, a relay lens 6 and a half mirror 7. When the objective is operated at the intermediate position of positions where outputs A, B from the two CCDs are each maximized, the focus can be adjusted onto the surface of the wafer.
申请公布号 JPS60102736(A) 申请公布日期 1985.06.06
申请号 JP19830209794 申请日期 1983.11.10
申请人 HITACHI DENSHI ENGINEERING KK 发明人 NEMOTO RIYOUJI
分类号 H01L21/66;G03F9/00;H01L21/027;H01L21/30 主分类号 H01L21/66
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