| 摘要 |
<p>A multipoint dispensing of viscous material onto a board (23) comprises the monitoring and controlling of several process parameters such as the initial gap (δ) between a dispensing tool (20, 25) and the board (23), the dispense pressure time cycle within the tool (Fig. 3A) and the tool velocity cycle (Fig. 3B). Also, an improved method for loading solder paste into the dispensing tool includes applying vacuum to two regions of the tool while vibrating it in its axial direction (Fig. 4) . Furthermore, improved techniques for preventing crust formation on the paste within the tool, and for controlling the viscosity of the solder paste within the tool, achieve consistent dispensing results in a production environment (Fig. 5).</p> |
