| 摘要 |
A solder leveller comprising a solder bath into which a board to be soldered can be inserted and then, as it is withdrawn, levelled by air knives positioned above the bath. Recirculating means are provided in the form of ducts on each side wall of the bath, the ducts having ports directing a flow of solder against opposite sides of a board to bias the board away from the sidewalls of the bath, thereby reducing the risk of the board being scratched as it is inserted and withdrawn from the bath.
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