| 摘要 |
<p>PURPOSE:To prevent position deviation even if a part where a semiconductor pad and inner leads are connected by using a through hole in a semiconductor chip, is molded with a resin, by machining recess parts or protruding parts at the rear surface of the semiconductor chip and the inner lead parts. CONSTITUTION:A recess part 6 is formed in the rear surface of a semiconductor chip 1. Protruding parts 7 and 7' are formed in the vicinities of the tip part at the upper and rear surfaces of each inner lead 5. The forming position of the recess part 6 is determined as follows: at least a part of the recess part 6 lies within a range of an area, whose radius is (r) with the central axial line of a through hole 3 as the center of the area. Meanwhile, the recess part is located so that its center is located at a point separated from the end surface of the inner lead 5 by a distance (m). The center of the recess part 7' is located at a point separated from the end surface of the lead 5 by a distance m'. Both (m) and m' lie within the range of 1/2 the total length of the inner lead 5. In any case, each recess part is brought to the through hole 3 as close as possible. Since a resin 2 penetrates into each recess part, positional is not yielded between the semiconductor chip 1 and the inner lead 5.</p> |
