| 发明名称 |
Circuit board substrates of improved thermal conductivity |
| 摘要 |
A circuit board substrate of good thermal conductivity comprises a composite formed from (A) an electrically and thermally insulating plastic and (B) a plastic incorporating a thermally highly conductive filler.
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| 申请公布号 |
US4886686(A) |
申请公布日期 |
1989.12.12 |
| 申请号 |
US19880267275 |
申请日期 |
1988.11.04 |
| 申请人 |
BASF AKTIENGESELLSCHAFT |
发明人 |
MUENSTEDT, HELMUT |
| 分类号 |
H05K1/02;H05K1/03;H05K7/20;(IPC1-7):B32B9/00 |
主分类号 |
H05K1/02 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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