| 摘要 |
<p>PURPOSE:To prevent a short-circuit due to adhesive by forming a placing pad, connecting pads and protrusions for specifying the position of a semiconductor chip at a predetermined interval from the connecting pads on a pin grid array PGA substrate. CONSTITUTION:A placing pad 2 for placing a semiconductor chip 4, and a plurality of connecting pads 3 electrically connected to the chip 4 are printed and baked on a PGA substrate 1 in which pins 8 are inserted to the lower face. A plurality of protrusions 11 for specifying the position of the chip are printed and baked similarly to the pads 2, 3 at a predetermined interval from the inner end of the pad 3. Thus, in case of adhering, the movement of the chip 4 is limited, and the adherence of the excess adhesive to the pad 3, semiconductor leads is prevented, its short-circuit is prevented, and an insulation is proved.</p> |
