发明名称 ELECTROLESS COPPER PLATING DEVICE FOR PRINTED WIRING BOARD
摘要 PURPOSE:To freely and remarkably improve processing capacity by disposing conveyors in upper and lower multiple stages. CONSTITUTION:Oil tanks 15-17 are formed three upper and lower stages corresponding to conveyors 11-13, in a room state, the conveyors 11-13 are disposed in a dipping type in contained electroless copper plating solution 3, and printed wiring boards P are conveyed from upstream sides 111-131 to downstream sides 112-132. The boards P are dipped in the solution 3 while being conveyed in parallel at the upper and lower positions by the conveyors, the inner walls of through holes are electrolessly copper plated, and front and rear circuits are connected. Thus, the processing capacity per unit time is remarkably improved.
申请公布号 JPH0234989(A) 申请公布日期 1990.02.05
申请号 JP19880185186 申请日期 1988.07.25
申请人 TOKYO KAKOKI KK 发明人 NIIYAMA KISABURO
分类号 C23C18/16;C23C18/31;C23C18/40;H05K3/42 主分类号 C23C18/16
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