| 摘要 |
<p>PURPOSE:To realize mass production and reduction of processes by forming an inner layer copper circuit board readily by drill-processing or router- processing a copper foil, and by manufacturing a multilayer board by one formation. CONSTITUTION:An inner layer circuit pattern 1 is composed of an inner layer circuit part 2, a flow end part 3 and a connecting part 4 between two-point chain lines. The inner layer circuit part 2 is provided with a number of clearance holes 7. The flow end part 3 is provided to keep a board thickness as constant as possible during formation, to prevent resin from flowing out and to manufacture a reference hole 6 for processing after pattern print, etc. The connecting part 4 connects the inner layer circuit part 2 and the flow end part 3 which are connected integrally to form an inner layer circuit pattern 1. From the final multilayer wiring board size 5, flow end part 3 and the connecting part 4 are excepted. The inner layer circuit board which is thus obtained is used for a versatile low multilayer board.</p> |
