| 摘要 |
PURPOSE:To obtain a composition suitable for coating or sealing, etc., of electronic part materials having excellent adhesion with an epoxy resin and resistance to heat deflection by mixing a polyarylen sulfide, a specific vinyl copolymer and a fibrous reinforcing material, as necessary. CONSTITUTION:(A) 100 pts.wt. polyarylen sulfide is mixed with (B) 0.01-15 pts.wt. copolymer composed of an aromatic vinyl compound (e.g. styrene) and an unsaturated carboxylic acid (e.g. maleic acid or fumaric acid or an anhydride of said compound to afford the aimed composition. Furthermore, (C) 2-70wt.% fibrous reinforcing material is mixed, as necessary. |
