| 摘要 |
PURPOSE:To mold a mold part without deteriorating solder bonding performance to a printed board by so integrally forming a pressing surface in contact with the upper surface of each lead terminal on the inner surface of a molding cavity as to protrude toward the cavity. CONSTITUTION:Pressing surfaces 20-22 in contact with the upper surfaces of lead terminals 12-14 are so integrally formed on the inner surfaces 19b, 19c of a molding cavity 19 as to protrude toward the cavity 19. Accordingly, the terminals 12-14 when the terminals 12-14 are held by molds 17, 19 are so pressed as to be brought into strong contact with the bottom 19a of the cavity 19 by the surfaces 20-22. Thus, it can effectively reduce melted synthetic resin entering between the lower surfaces of the terminals 12-14 and the bottom 19a of the cavity 19, thereby eliminating improper soldering in the case of molding a mold. |
