RESIN SEALING TYPE SEMICONDUCTOR DEVICE

摘要

PURPOSE:To omit complicated process control, make small wiring resistance and reduce the wiring by connecting power supply leads and electrode on semiconductor element at the wiring part under the element. CONSTITUTION:A bed is provided with a couple of supporting portions 101 and leads 102 provided under the element between these supporting portions with a predetermined interval. A semiconductor element 100 is clamped by a die mount material 103 on the supporting portions 101. A lead 106 is arranged surrounding the supporting portions 101. Connection with a bonding pad 104 on the upper surface of element 100 is conducted using bonding wire 105. The entire part is molded by resin 108 for protection from water and impact. Here, a semiconductor device of reduced size which does not require complicated process control and has small wiring resistance can be obtained by connecting between the power supply leads and the electrodes on the element 100 separated from such leads with the wiring under the element.