| 摘要 |
PURPOSE:To mount semiconductor elements on both surfaces of a wiring board by mounting one semiconductor element on one surface of the wiring board by a wire bonding technique and another semiconductor element on the other surface by a flip flop technique. CONSTITUTION:A semiconductor element 11 is stuck to a mounting land 13 provided on one surface of a thick-film printed board 10 with, for example, silver/epoxy paste 12 and an electrode pad 14 of the element 11 is connected to a connection land 15 of the board 13 with gold wires 16 having a diameter of 30mum. On the other hand, connection lands 18 and protective glass layers 19 are provided on the other surface of the board 10 and a semiconductor element 20 is connected to the lands 18 through solder bumps 21 made of, for example, lead-tin eutectic solder. Therefore, double-face mounting of bare semiconductor elements which has been difficult in the conventional hybrid integrated circuit can be realized.
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