发明名称 |
Method of and apparatus for depositing solder on a printed circuit board |
摘要 |
Solder is deposited on a printed circuit board by melting the solder in a container. The container has a slot for passage of solder, therethrough and control means actuable to alternately allow and prevent passage of solder through the slot. The slot is placed in contact with a stencil and the control means is actuated to allow passage of solder through the slot. The stencil is moved relative to the container in a direction transverse of the slot to deposit solder on the printed circuit board via the stencil.
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申请公布号 |
US5395643(A) |
申请公布日期 |
1995.03.07 |
申请号 |
US19940190700 |
申请日期 |
1994.02.02 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BROWN, JOHN;MURRAY, KENNETH;MCNEE, JAMES;ROBERTSON, BRIAN |
分类号 |
B23K3/06;H05K3/12;H05K3/34;(IPC1-7):B05D1/00 |
主分类号 |
B23K3/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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