MANUFACTURE OF INNER CIRCUIT BOARD AND MULTILAYER LAMINATED BOARD EQUIPPED THEREWITH

摘要

PURPOSE: To provide a method of manufacturing an inner circuit board equipped with a copper circuit of high reliability and a multilayer laminated board equipped with the inner circuit board. CONSTITUTION: An inner circuit board is manufactured through such a method that a copper circuit formed on a board is subjected to soft etching with a soft etching liquid which contains hydrochloric acid and cupric chloride as components, and the board is rinsed with water and then subjected to an oxidation treatment for forming a copper oxide film on the copper circuit. At this point, the board taken out of the soft etching liquid kept at temperatures of 20 to 35 deg.C is made to stand in an atmosphere kept at temperatures of 5 to 30 deg.C before it is rinsed with water. The inner circuit boards and prepregs are laminated and bonded together by thermocompression into a multilayer laminated board.