METAL FOIL-PLATED LAMINATED BOARD, MANUFACTURE THEREOF, AND METAL FOIL

摘要

PURPOSE: To obtain a metal foil-plated laminated board which is suitable for a high- density printed wiring board where an electroless plating bridge is restrained from being formed between patterns by a method wherein a thin layer which contains plating stabilizer that has an effect to restrain electroless plating from being deposited is provided under the metal foil. CONSTITUTION: A sheet-like base layer impregnated with thermosetting resin and a metal foil disposed on it are formed by thermocompression into a metal foil-plated laminated board of integral structure. Especially, a thin layer of plating stabilizer which has an effect to restrain electroless plating from being deposited is provided under the metal foil. Wiring patterns 1 each 150μm wide and arranged in parallel with each other separate from each other by 150μm are formed by etching the copper foil of a copper-plated laminated board so as to ascertain the deposition of electroless plating. This test piece is employed in an electroplating process so as to evaluate the quality of plating deposition on the wiring patterns 1 and to check if abnormal plating deposition is present on the surface 2 of the laminated board. By this setup, a metal foil-plated laminated board where an electroless plating bridge is restrained from being formed in patterns and which is suitable for a high-density printed wiring board can be obtained.