| 摘要 |
PROBLEM TO BE SOLVED: To provide a means for allowing adhesion of a connection of a semiconductor-type package to be improved when thermoplastic resin is used as a material of the package, thereby obtaining a highly reliable semiconductor sensor with a low manufacturing cost. SOLUTION: An assembly comprising a sensor element 1 made of silicon and a lead frame 2 electrically connected to the sensor element 1 via a bonding wire 4 is covered by a plastic package comprising a cap 5 and a base 6 respectively made of PPS resin or PET resin. While a cap lower connection 5a and a base upper connection 6a are improved in quality by application of ultraviolet rays to have their adhesion improved, the package is bonded to the lead frame 2 using adhesive 3, thereby improving reliability of a sensor P1 and reducing its manufacturing cost. |
