| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing device with which the surface of an insulating film or a metal film deposited on a semiconductor wafer can be polished uniformly and flatly. SOLUTION: The title polishing device is provided with a polishing board 2 which revolves in the direction same as the center axis and having air intake hole 2b1 communicated to a vacuum pump 11, the first pad 3a, which is communicated to air intake holes 2b2 consisting of soft material which is glued to the polishing board 2 and having a plurality of bubbles 12, and a polishing pad 3 which is composed of the second pad layer 3c consisting of hard material which is glued to the first pad layer 3a. In the case of a semiconductor wafer on which an insulating film layer is formed on the surface of the object of polishing, a polishing operation is conducted to the prescribed extent in the state wherein bubbles 12 are sucked, and then the remaining part is polished in the state wherein sucking force is removed. Also, in the case of a semiconductor wafer on which a conductive film layer is formed on the surface of the object of polishing, a polishing operation is conducted by an inverted process. |
