| 摘要 |
<p>PROBLEM TO BE SOLVED: To manufacture a semiconductor device using a tape material having a heat resistance lower than the bake temperature at the time of securing the semiconductor device to a metal plate using a mounting material by bonding the lead of a lead frame onto the metal plate after the semiconductor device is secured to the metal plate using the mounting material. SOLUTION: A semiconductor device 6 is secured to a metal plate 4 of 50-500μm thick at a high temperature using a mounting material, e.g. an Au ribbon or Ag paste. The metal plate is then pasted to a lead frame of 42 alloy or Cu alloy provided with leads by etching or press using an insulating adhesive tape employing a polymer film, or the like, as a basic material. The metal plate mounting the semiconductor element is pasted to the lead frame through an adhesive tape at a temperature lower than the heat resistance of the adhesive tape. More specifically, it is pasted at a temperature lower than the glass transition point on account of preventing deformation of the lead after pasting and the accuracy of pasting.</p> |
