发明名称 |
WAFER DEBONDER AND WAFER DEBONDING METHOD USING THE WAFER DEBONDER |
摘要 |
Wafer debonding of a bonded bulk wafer and a device wafer using a liquid jet to avoid scratching of the wafers is provided. The wafer debonder includes a wafer loader having a first stand with a flat upper surface and a second stand located above the first stand having a lower surface slanted with respect to the upper surface of the first stand at a predetermined angle. A first holder is connected to the first stand and a second holder is located on an imaginary surface extended from the lower surface of the second stand for holding the wafers. A liquid jetting nozzle is positioned adjacent the wafer loader to direct a jet of liquid at the interface between the wafers to separate the wafers. |
申请公布号 |
KR0165467(B1) |
申请公布日期 |
1999.02.01 |
申请号 |
KR19950039045 |
申请日期 |
1995.10.31 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
CHA, KI-HO;LEE, BYUNG-HUN |
分类号 |
H01L27/12;B26D3/28;B26F3/00;B32B43/00;H01L21/00;H01L21/02;H01L21/20;H01L21/30;H01L21/304;H01L21/58;(IPC1-7):H01L21/20 |
主分类号 |
H01L27/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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