Selective via fill using a sacrificial layer,申请号EP19970107036-传众专利搜索

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发明名称	Selective via fill using a sacrificial layer
摘要
申请公布号	EP0805489(A3)	申请公布日期	1999.02.03
申请号	EP19970107036	申请日期	1997.04.29
申请人	APPLIED MATERIALS, INC.	发明人	CHEN, LIAN-YUH;GUO, TED TIE;HOINKIS, MARK;MOSELY, RODERICK CRAIG;NAIK, MEHUL;ZHANG, HONG
分类号	H01L21/285;H01L21/28;H01L21/3205;H01L21/768;H01L23/52;(IPC1-7):H01L21/768	主分类号	H01L21/285
代理机构		代理人
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