发明名称 Cartridge type CPU module cooling structure
摘要 A cartridge type CPU module cooling structure includes a fixing plate fastened to upright mounting rods of a heat sink to hold down a CPU module on the heat sink, wherein the upright mounting rods of the heat sink each have a neck; the fixing plate has a plurality of projecting spring leaves respectively coupled to the upright mounting rods of the heat sink, and a plurality of mounting slots respectively extended to the spring leaves for permitting the spring leaves to be coupled to the upright mounting rods, the mounting slots each having an expanded insertion portion at one end through which one upright mounting rod of the heat sink is inserted to hold the fixing plate on the CPU module at a first position, and an elongated guide portion extended from the respective expanded insertion portion to a part of one spring leaf into which the neck of one upright mounting rod is engaged to hold the fixing plate on the CPU module at a second position, causing the respective spring leaf to deform and to impart a pressure to the CPU module against the heat sink.
申请公布号 US6008990(A) 申请公布日期 1999.12.28
申请号 US19980197517 申请日期 1998.11.23
申请人 LIU, YEN-WEN 发明人 LIU, YEN-WEN
分类号 H01L23/40;H05K7/20;(IPC1-7):H05K7/20 主分类号 H01L23/40
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