| 摘要 |
An inspection system (10) and method uses a first illumination apparatus, su ch as a ring illumination apparatus (20) to illuminate one or more reflective elements, such as solder balls on an electronic component or other protrudin g surfaces or objects. The ring illumination apparatus includes a substantiall y ring shaped light source (24) that provides a substantially even illuminatio n across the one or more reflective elements. An illumination detection device (30) detects light beams reflecting off of the illuminated reflective elemen ts for forming a first captured image. The system and method then uses a second , different illumination apparatus, such as an on-axis illumination apparatus (90) to illuminate the reflective elements. The second illumination apparatu s is selected so as to illuminate unwanted reflective elements substantially t he same as they are illuminated by the first illumination apparatus while illuminating the desired reflective elements differently. A second image of the object is then captured by the illumination detection device. The second image is then subtracted from the first or vice-versa by an image processor (38) to generate a resulting image that is substantially devoid of the unwanted reflective elements, yet including the desired reflective elements, which are further analyzed using additional image analysis techniques.</SDOA B>
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