发明名称 POLISHING PAD, POLISHING DEVICE AND METHOD TO MANUFACTURE POLISHED BODY HAVING FLAT SURFACE
摘要 PROBLEM TO BE SOLVED: To provide a polishing pad capable of stably maintain a polishing rate high without requiring dressing and a polishing device furnished with this polishing pad. SOLUTION: A polishing pad 40 constituted to have open cells by bonding hard material powder by a base material has a passing groove 30 of slurry for polishing in the thickness direction. It is favourable to make the base material of a soft resin 10 and the hard material powder of hard resin powder. Additionally, it is favourable to make hardness within a range of more than 60 degrees and less than 90 degrees (JIS-K6301) and hardness of the hard resin powder more than 95 degrees (JIS-K6301). Additionally, a polishing device is furnished with this polishing pad 40, a surface plate to install the polishing pad 40 and a head to hold a polished body so as to face against the polishing pad 40 and is constituted so that the polishing pad 40 polishes the polished body by using the slurry for polishing.
申请公布号 JP2000354950(A) 申请公布日期 2000.12.26
申请号 JP19990167892 申请日期 1999.06.15
申请人 SUMITOMO METAL IND LTD 发明人 SAGUCHI AKIHIKO;TAKAHASHI WATARU;WATANABE JUNJI
分类号 B24B37/20;B24B37/24;H01L21/304 主分类号 B24B37/20
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