发明名称 |
POLISHING PAD, POLISHING DEVICE AND METHOD TO MANUFACTURE POLISHED BODY HAVING FLAT SURFACE |
摘要 |
PROBLEM TO BE SOLVED: To provide a polishing pad capable of stably maintain a polishing rate high without requiring dressing and a polishing device furnished with this polishing pad. SOLUTION: A polishing pad 40 constituted to have open cells by bonding hard material powder by a base material has a passing groove 30 of slurry for polishing in the thickness direction. It is favourable to make the base material of a soft resin 10 and the hard material powder of hard resin powder. Additionally, it is favourable to make hardness within a range of more than 60 degrees and less than 90 degrees (JIS-K6301) and hardness of the hard resin powder more than 95 degrees (JIS-K6301). Additionally, a polishing device is furnished with this polishing pad 40, a surface plate to install the polishing pad 40 and a head to hold a polished body so as to face against the polishing pad 40 and is constituted so that the polishing pad 40 polishes the polished body by using the slurry for polishing. |
申请公布号 |
JP2000354950(A) |
申请公布日期 |
2000.12.26 |
申请号 |
JP19990167892 |
申请日期 |
1999.06.15 |
申请人 |
SUMITOMO METAL IND LTD |
发明人 |
SAGUCHI AKIHIKO;TAKAHASHI WATARU;WATANABE JUNJI |
分类号 |
B24B37/20;B24B37/24;H01L21/304 |
主分类号 |
B24B37/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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