| 摘要 |
<p>PROBLEM TO BE SOLVED: To enable to array contact pins at a narrow-pitch, have them stably contacted with each electrode for inspection absorbing their difference in height and yet realize a high speed signal transfer. SOLUTION: With the probe card with a plurality of contact pins connected on a circuit board to be connected in contact with electrodes for inspection for a semiconductor chip for inspecting electric characteristics of the semiconductor chip, contact pins are to be of micro-spring structure.</p> |
