| 摘要 |
PROBLEM TO BE SOLVED: To shorten the length of a metal wire comprising a plurality of wires for connecting a semiconductor chip to a metal electrode plate for making the length uniform. SOLUTION: The semiconductor chips 3a and 3b are bonded to the metal electrode plates 10 and 20, and the metal electrode plate 30 is arranged at the upper section of the metal electrode plate 20. The metal electrode plate 20 is extended to the upper section of the metal electrode plate 10, surrounds the semiconductor chip 3a by extended sections 25 and 26, and is connected to the upper surface of the semiconductor chip by the metal wire 5a that is divided into two sections. Similarly, the metal electrode plate 30 surrounds the semiconductor chip 3b by extended sections 35 and 36, and is connected to the upper surface of the semiconductor chip by a metal wire 5b that is divided into two sections. The metal wire is divided into two sections, thus making each wire of the metal wire uniform in length, and preventing concentration in current. Also, difference in height is small between the upper surface of each semiconductor chip and the surface of the metal electrode plate, thus improving superior responsiveness. |
