发明名称 Semiconductor device manufacturing method
摘要 This invention is directed to the reduction of voltage dependence and thus allows easy design of integrated semiconductor circuits. The device is equipped with a P- type resistance layer, in which a first voltage is applied to one end and a second voltage is applied to the other end and which is formed on the surface of an N-well region on the semiconductor substrate, a thin oxide film on the resistance layer, and a resistance bias electrode which includes the silicon layer formed on the thin oxide film. By adjusting the voltage applied to the resistance bias electrode, the voltage dependence of the resistance of the resistance layer is reduced.
申请公布号 US6858489(B2) 申请公布日期 2005.02.22
申请号 US20030656142 申请日期 2003.09.08
申请人 SANYO ELECTRIC CO., LTD. 发明人 SEKIKAWA NOBUYUKI;HIRATA KOICHI;MOMEN MASAAKI;ENOMOTO SHINYA
分类号 H01L27/04;H01L21/822;H01L21/8234;H01L27/06;(IPC1-7):H01L21/00 主分类号 H01L27/04
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