| 摘要 |
PROBLEM TO BE SOLVED: To make it possible to form ruggedness on a substrate surface by specifying the etching rate in the thickness direction of a shielding film at the time of etching the substrate surface by concealing the shielding film for coating the substrate surface with a photoresist. SOLUTION: The surface of the substrate 1 consisting of quartz glass disks is successively coated with a chromium oxide film and a metallic chromium film to form the shielding film 2. The surface of the shielding film 2 is concealed to a prescribed shape by the photoresist 3. If the exposed parts of the unconcealed shielding film 2 are removed by etching, the etching rate of the oxide chromium layer and chromium layer of the shielding film 2 vary and, therefore, the sectional shape of the patterns of the shielding film 2 is formed to a V shape. The substrate is then brought into contact with a hydrosilicofluoric acid soln. while the patterned resist film 3 is made to remain, by which a silicon dioxide film 4 is deposited on the substrate surface from which the shielding film 2 is removed. The photoresist 3 and the shielding film 2 are thereafter removed. As a result, the mother substrate for producing recording media having the fine patterns of grooves provided with the V-shaped sectional shape on the substrate surface is obtd. |
