发明名称 |
Semiconductor device and method of fabricating the same |
摘要 |
A semiconductor device comprises a semiconductor IC chip provided with electrode pads, and an insulating layer formed on a surface of the semiconductor IC chip, on the side of the electrode pads. Connecting terminals on the outer surface of the insulating layer and the electrode pads are connected by conductive posts. The insulating layer is formed of an insulating elastic material, and the conductive posts are formed of a conductive elastic material. |
申请公布号 |
US2005167831(A1) |
申请公布日期 |
2005.08.04 |
申请号 |
US20050092619 |
申请日期 |
2005.03.30 |
申请人 |
DAI NIPPON PRINTING CO., LTD. |
发明人 |
TSUBOSAKI KUNIHIRO |
分类号 |
H01L23/52;H01L21/3205;H01L23/12;H01L23/31;H01L23/485;H05K1/02;H05K3/34;(IPC1-7):H01L23/48 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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