| 摘要 |
A ceramic substrate ( 100 ) includes a top surface, a plurality of identification marks ( 104 ), a protective compound ( 110 ), a bottom surface, and a plurality of grooves ( 106 ). The top surface includes a first area and a second area. The first area is defined at one or more edges portions of the top surface. The second area is defined inside the first area. The identification marks are arranged on the first area. The protective compound is covered on the second area. The grooves are defined at the bottom surface, and corresponding to the identification marks. A related method for breaking a ceramic substrate includes: (a) pasting one or more tapes on the first area; (b) covering protective compound on the second area; (c) removing the tapes; (d) cutting the protective compound according to the identification marks; and (e) breaking the ceramic substrate into individual circuit unit pieces along the grooves.
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