发明名称 |
Connecting a Plurality of Bond Pads and/or Inner Leads With a Single Bond Wire |
摘要 |
An integrated circuit device comprising an integrated circuit die having a plurality of bond pads that are selectively connected to a plurality of inner leads of a leadframe. At least two bond pads are connected to at least one of the inner leads, and/or at least two inner leads are connected to at least one of bond pads with a single bond wire. A single bond wire is ball or wedge bonded to a first bond pad or inner lead and subsequently wedge bonded to one or more second bond pads or inner leads, then it is connected to a third or last bond pad or inner lead. The single bond wire requires only one connection area at each of the bond pad(s) and/or inner lead(s). The bond pad(s) of the die and/or inner lead(s) of the leadframe are thereby electrically connected together by the single bond wire.
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申请公布号 |
US2007215994(A1) |
申请公布日期 |
2007.09.20 |
申请号 |
US20060563803 |
申请日期 |
2006.11.28 |
申请人 |
MICROCHIP TECHNOLOGY INCORPORATED |
发明人 |
BEAUCHAMP BRUCE;TUTHILL ANDREW;FERNANDEZ JOSEPH D.;PHONGSANTICHAI ANUCHA |
分类号 |
H01L23/495;H01L21/00;H01L31/00 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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