发明名称 REFLECTION TYPE SENSOR PACKAGE AND METHOD FOR FABRICATING THE SAME
摘要 A reflection-type optical sensor package is provided to prevent an increase of the volume of a final product by including one light emitting or receiving device and a plurality of light receiving or emitting devices. One central device(120) is mounted on the center part of the surface of a printed circuit board. A plurality of outer devices(130) are mounted in the periphery of the printed circuit board with respect to the center of the printed circuit board. The central device and the outer device are isolated from external surroundings by a first molding part(140) for protecting the central device and the outer device. A second molding part(150) optically isolates the central device and the outer device, formed in the circumference of the central device. One of the central and outer device can be a light emitting device, and the other one of the central and outer device can be a light receiving device.
申请公布号 KR20080011517(A) 申请公布日期 2008.02.05
申请号 KR20060071938 申请日期 2006.07.31
申请人 KODENSHI KOREA CORP. 发明人 KIM, I SIK
分类号 H01L23/02;H01L23/04 主分类号 H01L23/02
代理机构 代理人
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