发明名称 |
Substrate processing apparatus and substrate processing method |
摘要 |
Substrate cleaning apparatus and method capable of preventing adhesion of particles to a substrate irrespective of being hydrophilic or hydrophobic are provided. Although a cleaning liquid ejected from a two-fluid nozzle 36 rebounds from a cup CP and scatters in the form of mist toward the center side of a wafer W, a rinsing liquid is supplied from a rinse nozzle 35 to form a water film 51 on the wafer W. Owing to the presence of the water film 51 , the surface of the wafer W is protected from adhesion of particles contained in the mist. It is possible to prevent the particles in the mist from adhering to the wafer W and also possible to prevent a bad influence on the wafer W.
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申请公布号 |
US7364626(B2) |
申请公布日期 |
2008.04.29 |
申请号 |
US20020285411 |
申请日期 |
2002.11.01 |
申请人 |
TOKYO ELECTRON LIMITED |
发明人 |
HIROSE KEIZO;SEKIGUCHI KENJI |
分类号 |
B08B3/04;H01L21/304;B08B3/02;H01L21/00 |
主分类号 |
B08B3/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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