| 摘要 |
An apparatus for molding a semiconductor package is provided to improve supply efficiency of a compound for molding supplied to a semiconductor package by directly supplying the compound for molding through one substrate without a compound distribution block. A cavity is formed in coupling a top mold and a bottom mold. A substrate(110) is positioned between the top mold and the bottom mold, and has a supply hole(112) for supplying a compound for molding to the cavity. A port(120) is connected to the supply hole, and supplies the compound for molding to the cavity. A plunger(130) is moved according to an inner surface of the port, and sends the compound for molding to the supply hole. The supply hole and the plunger have a shape of circular.
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