| 摘要 |
The present invention is a dicing die-bonding film (10) comprising a dicing film having a pressure-sensitive adhesive layer (2) on a base (1) and a die-bonding film (3) provided on the pressure-sensitive adhesive layer (2), wherein the pressure-sensitive adhesive layer (2) is formed from an acrylic pressure-sensitive adhesive comprising an acrylic polymer which comprises an acrylic ester, a hydroxyl group-containing monomer where a ratio is in a range of 10 to 40 mol% to 100 mol% of the acrylic ester, and an isocyanate compound having a radical reactive carbon-carbon double bond within a molecule where a ratio is in a range of 70 to 90 mol% to 100 mol% of the hydroxyl group-containing monomer, and a compound having two or more radical reactive carbon-carbon double bonds within a molecule where a ratio is in a range of 10 to 60 parts by weight to 100 parts by weight of the acrylic polymer, and the die-bonding film is formed from an epoxy resin and is laminated on the pressure-sensitive adhesive layer (2). |
