发明名称 Surface treating apparatus
摘要 An tank such as an electroless copper plating tank 200, includes a liquid squirting part 4 having a squirt port 6 for squirting the processing solution Q from the squirt port 6 toward the treatment object obliquely upward to a horizontal plane, and hitting the processing solution Q on the upper area of the plate-like work 10 so that the processing solution Q runs down the plate-like work 10.
申请公布号 US9359676(B2) 申请公布日期 2016.06.07
申请号 US201314038340 申请日期 2013.09.26
申请人 C. UYEMURA & CO., LTD. 发明人 Hotta Teruyuki;Yamamoto Hisamitsu;Ishizaki Takahiro;Utsumi Masayuki;Okamachi Takuya;Hoshi Syunsaku;Asa Fujio;Mizumoto Junji
分类号 B05B7/06;B05B15/12;B05C13/00;C23C18/16;H05K3/00;H05K3/18 主分类号 B05B7/06
代理机构 Sheridan Ross, PC 代理人 Vick Jason H.;Sheridan Ross, PC
主权项 1. A surface treating apparatus, comprising: a transport hanger that clamps and transports a thin plate treatment object, the transport hanger holding the treatment object vertically; a tank body, through which the transport hanger moves, that attaches processing solution interiorly to the treatment object; a liquid squirting part in the tank body that squirts the processing solution from squirt ports, located on both sides of the vertically held treatment objects, toward the treatment object, the squirt ports located in the squirting port at a squirt angle ranging from 5 degrees to 85 degrees, the squirt angle being an oblique angle only facing upward from a horizontal plane; and a transport mechanism that moves the transport hanger into the tank body.
地址 Osaka JP