发明名称 Electronic device having housing with embedded interconnects
摘要 An electronic device has an electronic device housing containing electrical components such as integrated circuits and other components. The electronic device housing may be provided with signal paths. Electrical components may be mounted to the electronic device housing and may be electrically coupled to the signal paths. The housing may be provided with channels in which signal lines are routed. The housing may be formed from a material such as metal. A layer of dielectric in the channel may be interposed between the metal of the housing and the signal lines in the channel. Capacitive coupling and inductive coupling may be used to electrically couple the electrical components to a signal line in the channel. Solder may be used to solder contacts on the electrical components to a signal line in the channel. Meandering channels and channels that traverse right-angled surfaces may be used.
申请公布号 US9400529(B2) 申请公布日期 2016.07.26
申请号 US201314040322 申请日期 2013.09.27
申请人 Apple Inc. 发明人 Chang Ray L.
分类号 G06F1/16;H04M1/02 主分类号 G06F1/16
代理机构 Treyz Law Group, P.C. 代理人 Treyz Law Group, P.C. ;Treyz G. Victor;Guihan Joseph F.
主权项 1. An electronic device, comprising: a metal electronic device housing having a wall, wherein the metal electronic device housing comprises a channel formed in the wall, wherein the electronic device has an exterior, and wherein the wall of the metal electronic device housing forms a portion of the exterior of the electronic device; a display mounted in the metal electronic device housing; a signal line on the metal electronic device housing that is formed in the channel; an electrical component that is electrically coupled to the signal line; dielectric in the channel between the metal electronic device housing and the signal line, wherein the signal line comprises a metal signal line, wherein the electrical component has a contact; and solder with which the contact is soldered to the metal signal line.
地址 Cupertino CA US