Adhesively bonding lead frame of semiconductor component to heat sink

摘要

Lead frame (108) of a semiconductor component is adhesively bonded to a heat sink (104) by a method in which a layer (311) of thermally conductive, electrically insulating epoxy resin is applied to at least part of a first surface of one of the components and is allowed to cure completely. A second layer (312) of thermally conductive, electrically insulating thermoplastic material or partly cured curable epoxy resin is applied to at least congruent areas of the second surface to be bonded or to the cured epoxy resin layer. The thermoplastic material is melted and allowed to solidify or the partly-cured epoxy resin is fully cured.