PROCESS FOR CORRECTING WARPED SURFACE OF PLASTIC ENCAPSULATED SEMICONDUCTOR DEVICE

摘要

A process for correcting the warped surface of a plastic encapsulated semiconductor lead frame device. The semiconductor device is placed on a transporting plate and transported to a heating device. The semiconductor device and the transporting device are clamped between a pair of heating plates and heated. Then the semiconductor device and the transporting plate are removed from the device and clamped between a pair of cooling plates and cooled. The warp is corrected to a substantially flat surface.