| 摘要 |
Disclosed is a disc-shaped, vacuum-applied, heating pad for applying heat and pressure during bonding of an object to a thermally conductive substrate using a thermosetting adhesive. The pad includes a flexible, resilient body having a generally flat bottom surface and a flexible vacuum lip depending downwardly from and around the periphery of the body. The lip terminates below the lower surface of the body such that the body and the lip define a shallow cavity on the underside of the pad. A flexible, metal foil electrical heating element is disposed on the underside of the body. The heating element is annular in shape, the aperture therein being positionable over the object to be bonded so that heat is transmitted from the heating element through the substrate and thence to the thermosetting adhesive disposed between the object and the substrate. Pressure is applied to the object being bonded by evacuating the cavity via a vacuum conduit communicating with the cavity and with the exterior of the pad. As the flexible pad is drawn down by the vacuum, the portion of the pad body within the aperture in the heating element contacts the object and applies pressure thereto.
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