发明名称 MULTILAYER PRINTED BOARD AND MANUFACTURE THEREOF
摘要 PURPOSE:To shorten the labor hour and time for the manufacture of a multilayer printed board by a method wherein shut-off holes for Tabata cutting the circuit parts of printed wirings from other parts are forced, these holes are covered with a mask and a plated layer is formed on the inner peripheries of through holes for connection use. CONSTITUTION:Through holes 7 for connection use are formed in a laminated material 24 formed by laminating base materials 21, which respectively have printed wirings 22 and 23 formed thereon, and a plated layer 9 is formed on the inner periphery of each hole 7. Shut-off holes 11 are formed in the specified printed wirings 22 and 23 formed on the surfaces different from each other of the upper and lower base materials 21. Thereby, parts unnecessary to circuits of the wirings 22 and 23 are cut. Accordingly, the holes 7 are formed in the intersecting points of arbitrary wirings 22 and 23 on an arbitrary surface among the surfaces of the base materials 21, the layer 9 is formed and at the same time, unnecessary parts of the wirings 22 and 23 are cut by the holes 11 and an arbitrary circuit is formed on the unnecessary parts of the wirings 22 and 23.
申请公布号 JPH04261098(A) 申请公布日期 1992.09.17
申请号 JP19910009164 申请日期 1991.01.29
申请人 MITSUBISHI ELECTRIC CORP 发明人 NISHIYAMA TAKESHI;OTA MAKOTO
分类号 H05K1/02;H05K1/00;H05K3/46 主分类号 H05K1/02
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