Arrangement for a double-sided cooling of disc-type semiconductors

摘要

This arrangement uses the shaft type of construction for forced cooling over heat sinks, the coolant remaining separate from the voltage-conducting parts of the semiconductors. To combine the cooling advantages of the double-sided cooling with the space advantages in the case of unilateral cooling and taking into consideration ease of maintenance of the devices and low smoothed constructional height, it is proposed that the heat sinks of both sides of the disc-type semiconductor (1) are arranged in a common cooling duct (9), one side of the disc-type semiconductor (1) being directly connected to the associated heat sink (2) and the other side of the disc-type semiconductor (1) being raised indirectly via a U-shaped cooling rail (3), which can be adapted to the spatial conditions and on the side legs (4) of which other heat sinks (5, 6) can be mounted, to the cooling duct level. <IMAGE>