| 摘要 |
<p>PURPOSE:To seal an IC chip in a small size inexpensively by plating the chip in a recess of a circuit board, wiring the chip, and screen printing thermoplastic resin on the upper surface of the chip. CONSTITUTION:An IC chip 3 is placed in a recess formed with a backing board 2 and a circuit board 1, and an electrode 3a is connected via a wire 4 to a circuit pattern 1a. The hole 5a of a mask 5 is set above the chip 3, and resin 6 is screen printed. According to this configuration, the projecting height of the wire 4 is formed as low as possible, and the IC is resin-sealed in the minimum space with sealing resin which has high shape retentivity with high viscosity. Since this can be performed with a simple facility such as the screen printing, it is inexpensive and can be decreased in the sealing shape.</p> |
