发明名称 |
Apparatus and method for uniformly polishing a wafer |
摘要 |
For providing a method for polishing in which it is possible to polish a substance uniformly over a whole surface of a wafer without observing the polished surface of the wafer halfway through polishing, a wafer with current detective patterns formed of conductors directly contacted with a semiconductor substrate, and an insulating film covering the current detective patterns is held by a wafer holder with conductivity, and the insulating film is polished by a polisher in which a supporting plate with conductivity is exposed in openings through a polishing cloth while supplying a polishing slurry containing ions.
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申请公布号 |
US5624300(A) |
申请公布日期 |
1997.04.29 |
申请号 |
US19960676663 |
申请日期 |
1996.07.10 |
申请人 |
FUJITSU LIMITED |
发明人 |
KISHII, SADAHIRO;ARIMOTO, YOSHIHIRO |
分类号 |
B24B37/04;B24B49/10;(IPC1-7):B24B1/00;B24B7/16 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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