| 摘要 |
PURPOSE:To obtain packages without dies for the convenience of manufacturing variety of types in small quantity by coating the rear surface of IC chip mounting surface of lead frame with a resin such as epoxy, fixing chips to the chip mounting surface, molding them with epoxy resin, causing the external lead protruded from the external circumference of chip to proturde to the rear surface of frame and cutting the lead of frame. CONSTITUTION:The rear surface of IC chip mounting surface of lead frame 1 is coated with resin 2 such as epoxy, IC chip 3 is fixed to the mounting surface and these are molded with the resin 3 which is also the epoxy resin but is smaller in size than the resin 2. Thereafter, a plurality of leads protruded from the periphery of chip 3 are bent and extended through the frame 1 and the lead 1b of frame is separated from external part of frame. Thereby, the dies for molding are no longer necessary and wire bonding can be realized easily. |
