| 摘要 |
<p>PURPOSE:To improve connection strength by a method wherein inner ends of external leads of a lead frame whose outer ends are lead out of molding resin are directly bonded to electrode pads of a semiconductor device. CONSTITUTION:Instead of conventional method wherein electrode pads of a semiconductor device which is mounted on the semiconductor device mounting part of a lead frame and inner ends of the leads of the lead frame are connected by fine metal wires, the inner ends of the leads of the lead frame are extended above the neighborhood of the electrode pads provided around the semiconductor device and the leads of the lead frame are directly bonded to the electrode pads. In other words, after the inner ends of the leads 3 of the lead frame which are extended above the neighborhood of the electrode pads are formed into narrow shapes and directly bonded to the electrode pads around the semiconductor device 5 mounted on the semiconductor device mounting part 1, the whole assembly is sealed with sealing resin 7.</p> |
