| 摘要 |
PURPOSE:To obtain a device capable of uniformly applying wax only onto the predetermined surface of a wafer without unevenness and capable of smooth ly executing a wax applying process rapidly by providing specific suction sec tion, support arm, rotary means and adhesive means. CONSTITUTION:A suction section 7 sucking one surface of a wafer W and holding the other surface of the wafer W, directing the other surface downward, a support arm 4 rotatably supporting the suction section 7 around the axis of the suction section 7, a rotary means 6 rotating the suction section 7 and an adhesive means 11 attaching wax onto the other surface of the wafer W are provided. The preheated wafer W is sucked by the suction section 7, the support arm 4 is turned, heating the wafer by a heating ring 12, and the wax applying surface of the wafer W is directed downward. A spoon 11 is elevated, and brought into contact with the lower surface of the wafer W under the state in which the inside of a wax receiving section 11a is filled with molten wax in a wax dissolver 8. The spoon 11 is lowered, and the suction section 7 is rotated at high speed by a rotary machine 6.
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