| 摘要 |
PURPOSE:To obtain a semiconductor device having stable quality, by mixing thickness adjusting filler in a bonding agent, using a macromolecular material such as resin and rubber constituting the bonding agent so that hardening and contracting factor is small, and controlling the thickness of the bonding layer. CONSTITUTION:A semiconductor element 4 is fixed on a resin substrate 1, from which outer connecting terminals 2 are extended downward. Said element 4 is sealed with silicone gel 8. A cap 9 is attached on a dam 7. Thus plastic type pin-grid-array package is formed. Thickness adjusting filler is mixed in a bonding material 10 for the cap 9 on the dam 7 in this package. In such a bonding material 10, filler is generally mixed for adjusting the viscosity of the bonding material. In many cases, the particle diameter of the material is usually 10 mum or less. In present invention, the filler having the relatively larger particle diameter than that is selected as the thickness adjusting filler 11 and mixed. It is desirable that filter, whose particle diameter is in a range of 10-100 mum, is selected.
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