发明名称 DETECTION SYSTEM FOR OUTER LEAD FOR SEMICONDUCTOR DEVICE
摘要 PURPOSE:To make compact a device while improving the reliability of detection by reflecting beams by an optical mirror from a tubular light source and projecting the reflected beams to CCD line sensors oppositely arranged to each outer lead row as transmitted beams. CONSTITUTION:A plurality of outer leads 5 to be measured, which are aligned in the same direction from opposed side surfaces in an approximately flat resin sealing layer 2, into which a semiconductor chip is buried, and lead out, are fixed by a positioning mechanism 8 shaped at the position 7 of measurement set to a carrying system. A single tubular light source 13 is disposed along the outer lead rows 5 to be measured. Beams from the tubular light source 13 are reflected by mirrors 15 shaped to the carrying system positioned between the outer lead rows 5 to be measured, and transmitted beams are projected to CCD line sensors 14 oppositely mounted to each row of the outer leads 5 to be measured. A straight pipe type fluorescent lamp 13 having a diameter such as approximately 10mm is arranged to a lower part between the outer leads 5, 5 as said tubular light source 13.
申请公布号 JPS63107034(A) 申请公布日期 1988.05.12
申请号 JP19860250638 申请日期 1986.10.23
申请人 TOSHIBA CORP 发明人 KANAZAWA TAKAKI;SHIMODA TATSUHIKO
分类号 H01L23/50;G01N21/88;G01N21/956;H01L21/66 主分类号 H01L23/50
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