Laser surface modification for seeding substrates.
摘要
<p>Method for selectively depositing metal onto ceramic and glass substrates by selectively melting a surface layer and thereafter contacting the melted surface with a seeding medium to deposit seed onto the melted surface. The seeded areas of the surface preferably are thereafter selectively plated with metal by contacting the surface with a suitable electroless plating solution.</p>
申请公布号
EP0377867(A2)
申请公布日期
1990.07.18
申请号
EP19890123434
申请日期
1989.12.19
申请人
INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人
HURST, JERRY ELDEN., JR.;OLSON, RADLEY WAHL;WIER-CAVALIERI, NANCY ANN;ZOLLNER, ALLAN